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Copper Sputtering PVD Vacuum Coating Machine On Ceramic Radiating Substrate

Categories PVD Vacuum Coating Machine
Brand Name: ROYAL
Model Number: RTAC1215-SP
Certification: ISO, CE, UL standard
Place of Origin: Made in China
MOQ: 1 set
Price: negotiable
Payment Terms: L/C, D/A, D/P, T/T
Supply Ability: 6 sets per month
Delivery Time: 12 weeks
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Chamber: Vertical Orientation, 1-door
Deposition Films: Ni, Cu, Ag, Au, Ti, Zr, Cr etc.
Applications: Al2O3, AlN ceramic circuit boards, Al2O3 plates on LED, semiconductor
Film Features: better Thermal Conductivity, strong adhesion, high density, low production cost
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    Copper Sputtering PVD Vacuum Coating Machine On Ceramic Radiating Substrate

    Ceramic Radiating Cooper Sputtering System / Ceramic Chips Directly Plating Copper Sputtering Equipment

    Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate

    The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate.

    Cooper conductive film deposition on Al2O3, AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, much lower production cost is its high feature.

    Royal technology team assisted our customer to developed the DPC process successfully with PVD sputtering technology.

    The RTAC1215-SP machine designed exclusively for Copper conductive film coating on Ceramic chips, ceramic circuit board.

    Copper Sputtering Coating Machine Key Features

    1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit.

    2. Multilayer and co-deposition coating available

    3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.

    4. Ceramic/ Al2O3/AlN substrates heating up unit;

    5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating.

    Copper Sputtering Coating Machine Specifications


    1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

    2. Operating Vacuum Pressure: 1.0×10-4 Torr.

    3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

    4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

    5. Operating Model: Full Automatically /Semi-Auto/ Manually


    The vacuum coating machine contains key completed system listed below:

    1. Vacuum Chamber

    2. Rouhging Vacuum Pumping System (Backing Pump Package)

    3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

    4. Electrical Control and Operation System

    5. Auxiliarry Facility System (Sub System)

    6. Deposition System

    Al2O3, AlN substrates with Copper Plating Samples

    Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

    Cheap Copper Sputtering PVD Vacuum Coating Machine On Ceramic Radiating Substrate for sale
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